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March 17, 2005

Dutch electronics firm Philips has introduced a low-power 802.11g wireless LAN semiconductor system-in-a-package (SiP) solution for the mobile phone market. The solution is to enable consumers to access voice, data and multimedia content through WLAN networks up to five times faster than current 802.11b products on the market without compromising the battery life of the mobile phone. The solution reduces receive and transmit operating power consumption. The low-power 802.11g WLAN SiP is pin- and software-compatible with Philips' existing low-power 802.11b SiP, enabling mobile phone manufacturers to upgrade existing WLAN-capable mobile phone designs.